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Force Technologies

Sector

ICs for Defence

Maintaining semiconductor supply for defence programmes where operational continuity cannot be compromised

The obsolescence problem in defence

Defence platforms — land vehicles, naval vessels, communications systems, weapons systems and support equipment — are designed for operational lives that can extend to 40 years or more. The semiconductors specified at the time of design rarely remain in production for anything like that period.

When a critical IC reaches End of Life, the options are rarely acceptable: redesign introduces cost, delay and requalification. Approved alternatives may not exist. Grey market and broker supply carries unacceptable counterfeit risk for safety-critical systems. And doing nothing risks operational capability.

Force Technologies provides a structured manufacturing route that avoids all of those outcomes. Working from the original device datasheet and specification, we develop replacement or sustained supply solutions that maintain form, fit and function — fully qualified to MIL-PRF-38535 and MIL-STD-883, and supported by AS9100 Rev D quality management.

Common challenges we solve

  • Defence platforms with 20–40 year operational lives outlasting component availability
  • Redesign not viable — cost, delay and requalification risk are prohibitive
  • Last-time buy stock depleted with no authorised alternative available
  • Grey market and broker supply unacceptable for safety-critical and flight-critical systems
  • MoD and prime contractor through-life support obligations requiring long-term supply assurance

Standard products for defence

Force Technologies manufactures a range of standard memory products in ceramic packages, qualified for defence applications including extended temperature and MIL-STD-883 compliant test flows.

Standard products for defence

Facing a semiconductor obsolescence problem on a defence programme?

Talk to our team about your device, programme and timeline. We will outline the most practical qualified route to maintaining supply.

Download our White Paper

Resolving obsolete component shortages using die extraction from plastic packages and re-assembly into ceramic or alternate plastic packages

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