When a semiconductor component becomes obsolete, the silicon die inside an existing package may still provide a route to continuity. For long-life programmes, sourcing an exact replacement can be difficult, risky or no longer possible. Redesign can also be expensive, time-consuming and disruptive, particularly when the existing design is already qualified and proven.
For some obsolescence challenges, Force Technologies can offer die extraction as a controlled route to recovering usable silicon from packaged components. The recovered die can then be inspected, prepared and repackaged to recreate the device your programme requires. This can help you maintain form, fit and function without moving straight to redesign or relying on uncertain sourcing routes.
Explore whether die extraction is a viable route for your obsolescence challenge. Get in touch today.
Following successful extraction, the recovered die can be prepared for reassembly into a suitable package, including plastic, hermetic ceramic, metal can or custom package formats. Where required, the original bond wires are trimmed to leave a clean gold surface for re-bonding, supporting strong adhesion during the reassembly process.
Environmental and parametric testing can then be carried out against the relevant datasheet, customer drawing or source control drawing to confirm suitability for use. Devices are supported with Force Technologies part numbering and process documentation, helping you maintain traceability for the component supplied.
Harvested die can also be stored in controlled conditions, ready for future assembly and test when your programme requires them.
Frequently asked questions
Can die extraction be used for any obsolete component?
Die extraction is most suitable when the die inside an existing packaged component is still usable and can be recovered without damage. Suitability depends on the original package type, device condition, available documentation and the requirements of the replacement component. Force Technologies can assess the device and advise whether extraction is a viable route for your obsolescence challenge.
What happens to the die after extraction?
Once recovered, the die can be inspected, prepared and repackaged into a suitable package format. This may include bond wire trimming, re-bonding and testing against the relevant datasheet, customer drawing or source control drawing. Harvested die can also be stored in controlled conditions for future assembly and test.
How does die extraction support form, fit and function?
Die extraction can allow usable silicon from an existing device to be repackaged in a way that supports the original component requirements. Form and fit can be achieved by packaging into the exact package the project requires. Final suitability depends on the device, package requirements and testing outcomes.
Ready to explore your options?
Contact our engineering team to discuss whether die extraction is a viable route for your obsolescence challenge.